Hbm package
Marzano using engagement strategies element
At this time, Intel's HBM add-on for Sapphire Rapids is expected to act as a Last-Level-Cache (LLC). Given the low latency nature of on-package HBM memory, the addition of HBM memory could be used to accelerate latency-sensitive workloads on Sapphire Rapids.
Package options for HBM plus logic include silicon interposers, fan-out on substrate using a redistribution layer, and many bridge solutions. HBM uses TSVs and μbumps to achieve a 3-D format.